Groundbreaking compute architecture
Embedded multi-die interconnect bridge (EMIB)
EMIB packaging technology developed by Intel® plays a key role in improving system performance by efficiently integrating high-performance and high-density dies. It delivers faster, more efficient data transfer and greater computing power, and enables lighter designs by increasing the number of cores in a single socket for next-generation workstation workloads.
Accelerate AI model training and inference
3rd Gen Intel® Deep Learning Boost
Accelerate AI model training and inference to support developers' end-to-end workflows. Intel® Advanced Matrix Extension (Intel® AMX/TMUL) is used to accelerate matrix operations to improve performance for AI and machine learning workloads.
Intel® vPro® Enterprise Technology
Manage your workplace more efficiently
Windows 10 Pro and 11 are also stable, giving you the tools you need to integrate and manage workstation platforms more seamlessly and securely within your existing network.
Hardware hardened protection with robust security systems
Highly reliable Intel® Xeon® processors prevent physical attacks and provide additional hardware protection for the Windows kernel.
ECC RDIMM memory
It includes separate registers used to buffer address, control, and clock, and supports x4 wide DRAM with Single Device Detection Correction (SDDC). This helps ensure data integrity, which is critical in business environments. ECC RDIMM memory is a good choice for increased stability, reliability, and performance.